02-15-2013, 10:52 PM
I am an entrepreneur, and I need to figure out the best way to create multilayer structures that alternate between highly conductive & semicontuctive. It would conventionally be done by laying up a stack of polymer-laminated foil, die cut to size; the die cutting wastes expensive material though, so I want to consider whether the multilayer structures I need by additive manufacturing. I'm very new at this, though as a polymer scientist I followed the early development keenly. It seems to me that normal laser sintering won't work because all the non-sintered material would have to be removed before the second different material could be put down. If there a method that makes it easier to put down alternating different layers? Are there any methods that can put down alternating layers of polymer and metal?[/size][/font]